Structural Performance(mm)
![8-ChMPEG-2/H.264标清编码器 8-ChMPEG-2/H.264标清编码器](https://0.rc.xiniu.com/g1/M00/F6/55/CgAGTFl5huGACoLAAAACjRuUx1g903.png)
(D×D×H) | 18×18×3 |
Ceramic Chip Diameter | 17.8±0.2 | Dceramic Chip Thickness | 3.0±0.1 |
d | 0.83±0.05 | h | 5.2±0.2 |
Product structure: feeding point eccentric 1.4mm ![1830 1830](https://0.rc.xiniu.com/g2/M00/09/61/CgAGe1meJqeAELcKAAAX8nAywE8782.png)
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Operating and Storage Temperature
![8-ChMPEG-2/H.264标清编码器 8-ChMPEG-2/H.264标清编码器](https://0.rc.xiniu.com/g1/M00/F6/55/CgAGTFl5huGACoLAAAACjRuUx1g903.png)
Operating Temperature | -40℃~+80℃ |
Storage Environment | Temperature:-10℃~+40℃、humidity:≤75%、Received within 6 months after the completion of the goods, the product directly exposed to the air in time≤12H |